EDAPS 2017

Accommodation

ACCOMODATION - HOTEL RESERVATION

Yuanzheng hotel (5 Star Hotel)

The Yuanzheng hotel is holding a block of rooms at special rates for conference attendees. Room reservations must be made by Dec.13, 2017 to guarantee these rate. After that time rooms will be released.

ADD:NO.718  East Haizhou Road,Haining,Zhejiang,China (In the ZJU-UIUC Campus),浙江海宁海州东路718号

Tel:  +86-13095609911

Email: yuanzhengaikaite@sina.com



RESERVATION CONFIRMATION (Click Here)


Phone bookings must be confirmed in written. Please send the RESERVATION CONFIRMATION file to the Email address (yuanzhengaikaite@sina.com) for  reservation.


Haizhou hotel (5 Star Hotel)

The Haizhou Hotel is holding a block of rooms at special rates for conference attendees. Room reservations must be made by November 20, 2017 to guarantee these rate. After that time rooms will be released.

ADD:NO.199  Haizhou Road,Haining,Zhejiang,China (7 km. from the ZJU-UIUC Campus), 浙江海宁海州路199号

Tel: 0573-87288888

Fax: 0573-87289555

Email: hotel@haizhouhotel.cn

Http://www.haizhouhotel.cn




Reservations may be made online by going to this link. Individuals must identify themselves as part of EDAPS conferenceto obtain the group rate.


Serviced Apartment (Only for student)

The serviced apartment is holding a block of rooms at special rates only for student attendees (50 RMB per night). Room reservations must be made by Dec. 7, 2017 to guarantee your reservation.

Please send your detailed information (name, gender, affiliation, phone number, email address) to the Email address (edaps_ningch@163.com)  for  reservation.


Andreas C Cangellaris

UIUC,

College of Engineering

Stochastic Electromagnetic Field Modeling for EMI/EMC-Aware Design of Electronic Systems

Kaustav Banerjee

University of California, Santa Barbara

2D Materials for Smart Life


Tetsu Tanaka

Tohoku University, Sendai, Japan

3D-IC Technology: Reliability Challenges and Biomedical Application


Philip T. Krein

University of Illinois at Urbana-Champaign

Integrating thermal, electrical, and materials issues for extreme-density power electronics



Jun Fan

EMC Laboratory, Missouri University of Science and Technology

Signal Integrity Designs of HBM in 3D Packaging