EDAPS 2017

Contact Us

MEETING  ADMINISTRATION
Questions regarding administration of the meeting may be directed to:
ningch@zju.edu.cn , Zllnnj@zju.edu.cn

Andreas C Cangellaris

UIUC,

College of Engineering

Stochastic Electromagnetic Field Modeling for EMI/EMC-Aware Design of Electronic Systems

Kaustav Banerjee

University of California, Santa Barbara

2D Materials for Smart Life


Tetsu Tanaka

Tohoku University, Sendai, Japan

3D-IC Technology: Reliability Challenges and Biomedical Application


Philip T. Krein

University of Illinois at Urbana-Champaign

Integrating thermal, electrical, and materials issues for extreme-density power electronics



Jun Fan

EMC Laboratory, Missouri University of Science and Technology

Signal Integrity Designs of HBM in 3D Packaging