EDAPS 2017

EDAPS Committee

General Co-Chairs

Wen-Yan Yin, Erping Li

Technical Program Committee Co-Chairs

Junfa Mao, Gaofeng Wang

Technical Program Committee Vice Co-Chairs

Kai Kang, Liang Zhou, Dazhi Ding, Yang Xu

Local Organization Committee Co-Chairs

Liandong Wang, Xueqin Yi, Qingfeng Zhang, Zhixiang Huang, Yingshui Xia


International Advisory Committee


Arun Chandrasekhar

Jianming Jin
Qing Huo Liu
Andreas C. Cangellaris
Jose Schutt-Aine
Ramachandra Achar
Antonio Orlandi
Joungho Kim
Rushan Chen
Christan Schuster
Jun Fan
Toshio Sudo
Erping Li
Junfa Mao
Tzong-Lin Wu
Erxiao Liu
Kai Kang
Wei Hong
Gaofeng Wang
Ke-Li Wu
Wen-Yan Yin
Hideki Asai
Madhavan Swaminathan
Weng Cho Chew
James L Drewniak
Qiang Chen
Zhongxiang Shen



Technical Program Committee


Arun Chandrasekhar

Liandong Wang

Wei Sha

Andreas Cangellaris

Linsheng Wu

Wensheng Zhao

Antonio Maffucci

Lingling Sun

Xiaoxiong Gu

Christan Schuster

Libo Qian

Xiuying Zhang

Fujiang Lin

Madhavan Swaminathan

Xingchang Wei

Gang Dai

Meisong Tong

Xiamin Zhang

Haiwen Liu

Min Tang

Xiaochu Li

Hideki Asai

Pingqi Gao

Xiaoning Ye

Hongsheng Chen

Qiang Chen

Xiaopeng Yu

Hongli Peng

Qifeng Liu

Xue Quan

Hui Tan

Ran Hao

Xunya Jiang

Ivan Ndip

Ramachandra Achar

Yi Zhao

Jianyong Xie

Sheng Sun

Yongle Wu

Jianyi Yang

Shaoqiu Xiao

Yongxin Guo

Jian Wang

Shurong Dong

Yonghu Zeng

Jose Schutt-Aine

Taijun Liu

Yufeng Jin

Joungho Kim

Toshio Sudo

Yue Ping Zhang

Jun Huang

Tzong-Lin Wu

Yujian Cheng

Kaixue Ma
Wenchao Chen
Zhenhong Fan
Ling Feng
Wenjian Yu
Zhizhang Chen
Lijun Jiang
Wenquan Che
Zhuo Cheng



Award Committee Co-Chairs

Yue Ping Zhang, Ke -Li Wu, Shurong Dong

Publicity Committee Co-Chairs

Yang Xu, Xingchang Wei

Sponsorship & Exhibition Co-Chairs

Shurong Dong, Linsheng Wu, Wenchao Chen

Finance Co-Chairs

Ran Hao, Hao Xie

Local Arrangements Co-Chairs

Yang Du, Xiaopeng Yu

Conference Secretary

Cheng Ning, Nuojun Lin(Caroline)

E-mail: ningch@zju.edu.cn , Zllnnj@zju.edu.cn

Andreas C Cangellaris
M. E. Van Valkenburg Professor in Electrical and Computer Engineering
Dean, College of Engineering

Kaustav Banerjee

University of California, Santa Barbara

2D Materials for Smart Life


Tetsu Tanaka

Tohoku University, Sendai, Japan

3D-IC Technology: Reliability Challenges and Biomedical Application


Jun Fan

EMC Laboratory, Missouri University of Science and Technology

Signal Integrity Designs of HBM in 3D Packaging