EDAPS 2017

Paper Submission



1. A THREE-PAGE (IEEE Xplore required) manuscript formatted according to the conference template (PDF files) by August 31 September 21, 2017.

2. An IEEE copyright transfer for mcompleted with paper title, Author(s) name(s) and Authors' signatures (files with scanned signatures are considered valid documents)
3. To be considered for student-paper award, (student should be the first author and) submit supervisor letter confirming that the student is enrolled full-time at an accredited institution at the time of paper submission, is the primary contributor of the presented work and will make the presentation if the paper is accepted.



When format the WORD document into PDF file, please make sure that you have choosed the ISO 19005-1(PDF/A) standard.




• Papers submitted without copyright forms or with incomplete copyright forms will not be processed.

• For IEEE templates, click here or choose in Latex, in .doc
• Notification about acceptance will be given by October 1 October 15, 2017.

• Accepted papers are reproduced in the Workshop proceedings and will appear in the IEEE xPLORE. A full registration is required for each accepted paper to be published.





  • Duration

Ÿ The time available for the presentation and discussion of every paper is about 20 minutes, session chairs will take care that the schedule is followed.

  • Equipment
Ÿ Speakers at the conference will have access to a traditional overhead projector and a video beamer that can be connected either to the room stationary PC (PowerPoint, Acrobat Reader and GSview installed) or their own laptop.
  • Additional Tips

Ÿ The use of the conference room PC is strongly encouraged. Speakers are kindly requested to load and test their presentations on the room PC during the break times.

In order to quickly start presentations, speakers preferring their own laptop computers are kindly requested to boot them and start the presentation program before the announcement of their papers




• A formal poster presentation will take place in a dedicated session, when the presenters will be kindly requested to stand by their posters.

• Format: one A0 panel (about 80 x 120 cm) will be available for each poster.
• Time: in order to increase the display time, poster presenters are encouraged to put their posters on display as soon as possible and to leave them on the panels until the end of the workshop.

For additional information contact: ningch@zju.edu.cn

Andreas C Cangellaris


College of Engineering

Stochastic Electromagnetic Field Modeling for EMI/EMC-Aware Design of Electronic Systems

Kaustav Banerjee

University of California, Santa Barbara

2D Materials for Smart Life

Tetsu Tanaka

Tohoku University, Sendai, Japan

3D-IC Technology: Reliability Challenges and Biomedical Application

Philip T. Krein

University of Illinois at Urbana-Champaign

Integrating thermal, electrical, and materials issues for extreme-density power electronics

Jun Fan

EMC Laboratory, Missouri University of Science and Technology

Signal Integrity Designs of HBM in 3D Packaging