EDAPS 2017

Local Organizers and Sponsors




During the last sixteen years, the IEEE Electrical Design of Advanced Packaging & Sytems (EDAPS) Symposium has evolved into a forum of exchange on the latest research and developments in the field of microelectronics system-level integration. Engineers from academia and industry worldwide convene every year to discuss the most important challenges in system-level design, modeling and simulation. EDAPS has championed the advancement of electrical performance and design methodologies since its inception more than a decade ago.

EDAPS is sponsored by the IEEE Components, Packaging and Manufacturing Technology Society. The location for the 2017 edition has been selected to be in Haining, Hangzhou, CHINA

EDAPS will be an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. It is expected that over 200 participants and 50 companies/universities will engage in the 3 full day conference and workshop, to be held during December 14-16 in Haining. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform. Sponsors will be given high visibility on the EDAPS web site, prominent placement of their logo/info in the conference proceedings, access to the EDAPS conference sessions, and premium display booth location.

To become a sponsor for EDAPS2017, please send request to: wyyin@zju.edu.cn

Andreas C Cangellaris


College of Engineering

Stochastic Electromagnetic Field Modeling for EMI/EMC-Aware Design of Electronic Systems

Kaustav Banerjee

University of California, Santa Barbara

2D Materials for Smart Life

Tetsu Tanaka

Tohoku University, Sendai, Japan

3D-IC Technology: Reliability Challenges and Biomedical Application

Philip T. Krein

University of Illinois at Urbana-Champaign

Integrating thermal, electrical, and materials issues for extreme-density power electronics

Jun Fan

EMC Laboratory, Missouri University of Science and Technology

Signal Integrity Designs of HBM in 3D Packaging