EDAPS 2017

Tutorials/Workshops and Special Sessions

Tutorial 1:

Title: High-Speed Circuit Modeling and Design Using X Parameters
Organizer & Speaker: Jose Schutt-Aine (University of Illinois, Urbana)
Contact Information: josec@emlab.illinois.edu

Tutorial 2:

Title: Achieving Power Integrity through a Systematic Physics-Based Design
Organizers: Prof. James L. Drewniak(Missouri University of Science and Technology, USA)
Contact Information: drewniak@mst.edu

1. Power Integrity Concepts for Physics-based PDN Design

Prof. James L. Drewniak, Missouri S&T EMC Laboratory
2. A Pre-layout Design Approach for Achieving a Target Impedance

Prof. Jun Fan, Missouri S&T EMC Laboratory

3. Low Inductance Decoupling Capacitor Interconnects and Library Models
Prof. Er-Ping Li, Zhejiang University
4. Calculating Time-domain Noise Voltage for Power Integrity
Prof. James L. Drewniak, Missouri S&T EMC Laboratory

Tutorial 3:

Title: Interconnect Characterization and IPC D24D Standard Development
Organizer: Prof. Jun Fan (Missouri University of Science and Technology, USA)
Contact Information: jfan@mst.edu
Speakers: Dr. Xiaoning Ye, Dr. Richard Zai, Dr. Chunfei Ye , Mr. Jimmy Hsu

Detialed Information (Click here)

Workshop 1:

Title: PEEC Modeling for Signal Integrity and EMC Analysis

Organizer: Ke-Li Wu  (The Chinese University of Hong Kong)

Contact Information: klwu@ee.cuhk.edu.hk

1. Circuit Oriented Electromagnetic Modeling Using the PEEC Techniques

Albert E. Ruehli, Giulio Antonini and Lijun Jiang*, University of Hong Kong

2. PEEC-Based Micro-Modeling Circuit for Signal Integrity – Its Theory, Algorithm, Passivity and Applications

Yuhang Dou and Ke-Li Wu, The Chinese University of Hong Kong

3.Key Challenges in EMI/ESD Control for 5G Telecommunication Network Products

Yao-Jiang Zhang, Huawei Technologies

4. The concept of radiation resistance in frequency-domain PEEC model

Chiu-Chih Chou and Tzong-Lin Wu, National Taiwan University

5. An effective PEEC modeling method to solve system-level ESD noise problems

Jingook Kim, Ulsan National Institute of Science and Technology

6. PEEC modeling for lightning protection, magnetic shielding and transient simulation

Patrick Y. Du, The Hong Kong Polytechnic University

Workshop 2:

Title: Multiphysis Modeling and Simulation for Advanced Integration and Packaging

Organizers: L. J. Jiang (University of Hongkong)、G. B. Xiao (Shanghai Jiao Tong University) 、J. M . Jin (University of Illinois)  and Xiaoxiong (Kevin) Gu

Contact Information:j-jin1@illinois.edu, jianglj@hku.hk, gaobiaoxiao@sjtu.edu.cn and xgu@us.ibm.com

Workshop 3:
Title: Analyzing Power Supply Induced Jitter in I/O Buffers: from Simple to Complex
Organizer: Jun Fan(Missouri University of Science and Technology, USA)
Contact Information: jfan@mst.edu
Speakers: Professor Jingook Kim ( jingook@unist.ac.kr) and Prof. Xiuqin Chu (xqchu@mail.xidian.edu.cn)

Workshop 4:
Title: Machine Learning for Hardware Design
Organizer: Madhavan Swaminathan
Contact Information: madhavan@ece.gatech.edu
Speaker: Prof. Paul Franzon (paulf@ncsu.edu)

Detialed Information (Click here)

Special Session 1:

Title: Carbon-based Interconnect Modeling and Design for 3-D Integration and Packaging Systems

Organizer: Libo Qian, Wen-Sheng Zhao

Contact Information: qianlibo@nbu.edu.cn and wshzhao@hdu.edu.cn

Special Session 2:

Title: Collaborative Design of High-Performance Miniaturized Passives for SoP

Organizer: Lin-Sheng Wu, Xiu-Yin Zhang

Contact Information: wallish@sjtu.edu.cn and zhangxiuyin@scut.edu.cn

Special Session 3:

Title: Computational Electromagnetics for Modeling, Analysis and Optimization of Advanced Integrated and Packaging Systems

Organizer: Xiaomin Pan, Dazhi Ding

Contact Information: xmpan@bit.edu.cn and dzding@njust.edu.cn

Special Session 4:

Title: Design and Simulation of High-Performance Interconnects and Microwave Circuits

Organizer: Xiaochun Li, Min Tang

Contact Information: lixc@sjtu.edu.cn and tm222@sjtu.edu.cn

Special Session 5:

Title: Advanced Packaging and 3D Integration

Organizer: Cheng Zhuo

Contact Information: czhuo@zju.edu.cn

Special Session 6:

Title: Multiphysics Modeling and Design of Transistors,Memory and Optoelectronic Devices for Low Power  ICs

Organizer: Wenchao Chen, Jun Huang

Contact Information:

wenchaochen@zju.edu.cn and huang599@purdue.edu

Special Session 7:

Title: Multiphysics Modeling and Design of Passives and Actives with High Reliability
Organizer: Liang Zhou

Contact Information: liangzhou@sjtu.edu.cn

Special Session 8:

Title: Emerging Materials and Device Technologies for ICs and Systems
Organizer: Yuehang Xu

Contact Information: yuehangxu@uestc.edu.cn

Special Session 9:

Title: Nano-Electronics for 3D-ICs and SiP

Organizer: Jing Chen and Yang Xu

Contact Information: j.chen@pku.edu.cn and yangxu-isee@zju.edu.cn

Special Session 10:

Title: Antenna and Packaging Systems

Organizer: Hongli Peng and Yaoping Zhang

Contact Information: hl.peng@sjtu.edu.cn and zhangyp58@sjtu.edu.cn

Special Session 11:

Title: Electronic Design of MM-Wave Integrated Circuits and Systems

Organizer: Kai Kang

Contact Information: kangkai@uestc.edu.cn

Special Session 12:

Title: Design of wearable and body-centric eleectronics modules and systems

Organizer:Prof. Gaosheng Li and Xianjun Huang

Contact Information: gaosheng7070@vip.163.com

Special Session 13:

Title: Metamaterials and Plasmonics: Electrical Designs for Advanced Integration and Packaging

Organizer:Prof.Qingfeng Zhang and Dr. Dongying Li

Contact Information:zhang.qf@sustc.edu.cn

Special Session 14:

Title: FDTD and FDFD Methods for CEM and Multiphysics Simulation of Mulitscale Structures

Organizer:Wei E.I. Sha and Zhixiang Huang

Contact Information: dr.weisha@gmail.com  and zxhuang@ahu.edu.cn

Special Session 15:

Title: Novel Structure Design for High Power Application

Organizer:Long Xiao and Yue Li

Contact Information: longxiaocn@yeah.net and lyee@tsinghua.edu.cn

Special Session 16:

Title: MMIC Design and Packaging

Organizer:Kaixue Ma and Fanyi Meng

Contact Information: makaixue@uestc.edu.cn and mengfanyi@uestc.edu.cn

Special Session 17:

Title: Electrical Design of Reconfigurable RF Devices and Circuits for Advanced Systems Integration

Organizer:Taijun Liu and Jian Wang

Contact Information: liutaijun@nbu.edu.cn and wangjian1@nbu.edu.cn

Information Template for Special_Session

Andreas C Cangellaris


College of Engineering

Stochastic Electromagnetic Field Modeling for EMI/EMC-Aware Design of Electronic Systems

Kaustav Banerjee

University of California, Santa Barbara

2D Materials for Smart Life

Tetsu Tanaka

Tohoku University, Sendai, Japan

3D-IC Technology: Reliability Challenges and Biomedical Application

Philip T. Krein

University of Illinois at Urbana-Champaign

Integrating thermal, electrical, and materials issues for extreme-density power electronics

Jun Fan

EMC Laboratory, Missouri University of Science and Technology

Signal Integrity Designs of HBM in 3D Packaging