EDAPS 2017

Conference Program


To Be Announced

Andreas C Cangellaris
M. E. Van Valkenburg Professor in Electrical and Computer Engineering
Dean, College of Engineering

Kaustav Banerjee

University of California, Santa Barbara

2D Materials for Smart Life


Tetsu Tanaka

Tohoku University, Sendai, Japan

3D-IC Technology: Reliability Challenges and Biomedical Application


Jun Fan

EMC Laboratory, Missouri University of Science and Technology

Signal Integrity Designs of HBM in 3D Packaging