EDAPS 2017

INTRODUCTION

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Symposium has been one of the main events in the Asia Pacific region with a focus on the electrical design of chips, packages and systems for electronics applications. For more than a decade, this symposium has attracted world class researchers from both academia and industry to share their state-of-the-art results in chips, packages and printed circuit board designs and measurements. The symposium consists of keynotes and invited talks from experts, paper presentations, industry exhibition, tutorials and an informal social setting for networking.

EDAPS is sponsored by the IEEE Components, Packaging and Manufacturing Technology Society. The EDAPS 2017 will be held in Haining, Hangzhou, China.
EDAPS is an excellent forum to highlight the latest advances in the high-speed and high-performance semiconductor industry. Engineers and researchers will engage in the 3 full day conference and workshop, to be held during December 14-16 in Haining. The forum offers a great opportunity for sponsorships and for the related companies to build their brands in this leading international platform.




Andreas C Cangellaris

UIUC,

College of Engineering

Stochastic Electromagnetic Field Modeling for EMI/EMC-Aware Design of Electronic Systems

Kaustav Banerjee

University of California, Santa Barbara

2D Materials for Smart Life


Tetsu Tanaka

Tohoku University, Sendai, Japan

3D-IC Technology: Reliability Challenges and Biomedical Application


Philip T. Krein

University of Illinois at Urbana-Champaign

Integrating thermal, electrical, and materials issues for extreme-density power electronics



Jun Fan

EMC Laboratory, Missouri University of Science and Technology

Signal Integrity Designs of HBM in 3D Packaging